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Build and grow a world-class Design organization at Tinder through mentorship, hiring and vision. A strong portfolio demonstrating large-scale design and product innovation for a large-scale global consumer brand.
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Demonstrable knowledge on IC design CAD tools such as Spectre, Spice, Matlab, Hsim, Verilog, etc. Perform system level & block level IC design activities including: Circuit Architecture definition, circuit design, schematic capture, circuit & sub-system simulation, chip floor-planning and layout planning.
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Experience: Minimum 5+ years of experience in Analog IC Design, with some experience in high voltage AC/DC technical aspects preferred. Strong understanding of digital design, RTL synthesis, Verilog AMS, SystemVerilog, and familiarity with analog circuit blocks and device physics.
$80,000 - $137,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Printed Circuit Board design to integrate FPGA with other on-board electronic. This person will lead the FPGA and circuit board design, implementation, and board bring-up to help enable a complete LiDAR system.
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In this position, you will get the opportunity to build complex GPU and Tegra chips and interact directly with unit-level ASIC, Physical Design, CAD, Package Design, Software, DFT and other teams.
$128,000 - $356,500 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Working knowledge of Cadence Allegro Packaging Design (APD) Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules. We are now looking for a Senior Package Design Engineer in the Advanced Technology Group (ATG.
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We are looking for qualified Analog circuit design engineers who have a good understanding of analog circuit and CMOS Image Sensor. Candidates should have the capability to design and develop analog circuit independently, as well as experience in debugging/verifying design issues, plus capability to do analog layout.
$200 - $250Full-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Expert in package design tools: Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP), and/or Siemens Xpedition platform tools (XPD/XSI/XLM). Design and develop a package and interconnect methods in the areas of SiP/modules, wafer level, and multi-chip module.
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Solid understanding of UX principles, design thinking, and human-centered design processes. We are looking for a talented User Experience (UX) Researcher who is passionate about making a difference in the world through responsible, data-driven innovations.
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You will join the Human Factors & Experience Design (HFXD) team and provide UX research leadership and support across multiple workstreams on OTTAVA. Champion UX in the business and collaborate extensively with leaders in other HFE teams, design, and product management to nurture a shared UX vision.
$119,500 - $191,500 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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10+ years of experience in the Semiconductor industry experience in Analog/Mixed-signal IC design. Sr. Staff Analog / Mixed-Signal IC Design Engineer. Lead the analog design and top-level integration of integrated circuits development.
$200,000 - $260,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Server Infrastructure design and Semiconductor device physics knowledge is a plus. The PMTS PAE will focus on post-silicon enablement work with partners including test planning and creation, characterization, data analysis, and customer/reference system design and characterization.
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The internship consists of hands-on design and verification activities including designing, testing, and documenting instrumentation against requirements. Do you love mechanical design, working with others, and seeing the designs come to life.
$23 - $25 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Experience in extraction of design parameters, QOR metrics, analyzing trends, voltage scaling (SVS, DVFS), and SRAM split rail implementation. Experience with ASIC physical design, physical design flows and methodologies (i.e., synthesis, place and route, STA, formal verification, CDC or power analysis using industry standard tools.
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3+ years of experience with RF HW Design for wireless consumer electronics or similar industry such as infotainment. Simulate RF HW design using a 3D EM simulation tool for product integration.
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Title: ux design Company: Club in Sunnyvale, CA
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