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We also formed Blue Polymers, a joint venture with Ravago, to develop facilities that will further process plastic material from our Polymer Centers to help meet the growing demand for sustainable packaging.
$152,020 a yearFull-timeExpandApply NowActive JobUpdated Yesterday - UpvoteDownvoteShare Job
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Material Supply Chain Packaging Development & Innovation. 3+ years of experience in supply chain analysis, packaging engineering, or sourcing within a food manufacturing or CPG enterprise.
$100,000 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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Silicon Photonics / Optical Packaging Engineer Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrate into short distance within the boards.
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Our digital ecosystem combines the power of technology to create beautiful smiles through the integration of AI and machine learning, digital imaging and visualization, biomechanics and material science to develop the Invisalign system, the most advanced clear aligner system in the world; iTero Intraoral Scanners andOrthoCADdigital services.
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Proficient understanding of packaging domains such as SMT, PCBA, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
$202,200 a yearFull-timeExpandApply NowActive JobUpdated 16 days ago - UpvoteDownvoteShare Job
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SWIFT (Simultaneous Wafer Inspection at Fast Throughput) systems deliver all-wafer-surface (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes as well as foundry/logic and memory fabs.
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General familiarity and interest in frontend development, including: Languages: JavaScript/Typescript/HTML/CSS Frontend frameworks: React/Vue/Angular Packaging frameworks: Webpack/Rollup/BaBel/AST/Gulp- Familiar with key concepts like functional and asynchronous programming, closures and types, layouts, specificity, animation, cross browser compatibility, data security and accessibility.
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As a Failure Analysis Engineer, the candidate will be reporting to the Director of Quality Assurance and will be interacting with internal customers and key support groups (Customer Quality, Product/Test Engineering, Design, Applications Eng., Packaging Eng. and others.
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Bachelor's or master's degree in electrical engineering, computer engineering, chemical engineering, material sciences, physics or any STEM related degree with 15+ years of related experience; or PhD degree in electrical engineering, computer engineering, chemical engineering, material sciences, physics, or any STEM related degree with 10+ years of related experience.
$284,620 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Scanning Electron Microscopy, Transmission Electron Microscopy, Focused Ion Beam system operations. Device physics and integrated circuit knowledge. Experience with government programs, e.g., DARPA, IARPA, DoD, DoC.
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Demonstrated use of schematic design and bill of material generation as well as design simulation using Altium tools. Familiarity with Orcad, Altium, LabView and AutoCad. Familiarity with custom PCB development including footprint generation and printed circuit board layout a plus.
$197,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Reporting to the head brewer and director of operations, this position involves all aspects of working in a brewery including wort production, fermentation, transfers, yeast management, and packaging.
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Working knowledge of Cadence Allegro Packaging Design (APD) Working knowledge of Cadence Allegro Packaging Design (APD) Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules.
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Adeia is seeking a Staff Engineer, Process & Characterization to join our team developing world-class advanced semiconductor packaging solutions including hybrid bonding. Working knowledge and experience in a variety of semiconductor processing and analysis techniques, including some of the following examples: atomic force microscopy (AFM), flip-chip bonding, etching, chemical mechanical polishing (CMP), c-mode scanning acoustic microscopy (c-SAM), scanning electron microscopy (SEM), surface analysis, optical interferometry, and ellipsometry.
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As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Knowledge of Material synthesis and material characterization.
$244,000 a yearFull-timeExpandApply NowActive JobUpdated Today
material handling packaging jobs in Milpitas, CA
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