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This can include system failure analysis, full systems engineering, FPGA/ASIC/Digital Design, Semiconductor manufacturing, and anti-tamper solutions to address global security threats for our government customer.
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Experience with failure analysis processes related to microelectronics (components or assemblies). Provides materials and processes support to the design, development, prototype fabrication, and design verification and qualification testing of communications system equipment, including receivers, transmitters, and digital processors, for military avionics and ground mobile applications.
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We are looking for you to join our team as a Materials and Processes Engineer/Principal Materials and Processes Engineer based out of San Diego, CA. As a Materials and Processes Engineer/Principal Materials and Processes Engineer at Northrop Grumman you will have a challenging and rewarding opportunity to be a part of our Enterprise-wide digital transformation.
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Automotive (ATV) shapes the future of mobility with microelectronics enabling clean, safe, and smart cars – Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
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We are looking for an electrical engineer focusing on digital components to support Strategic Microelectronics at Naval Surface Warfare Center (NSWC) Crane. Provide digital component engineering support to technologist team, to include writing technical reports.
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X/C, RS-232 serial port, I2C, SPI, JTAG, PCIe, SMBUS and SATA.Experience in detailed schematic capture and multi-layer PCB layout for analog, power, and high-speed digital circuits – *KiCad is a plus.
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Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability.
$97,500 - $176,250 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Design, documentation, implementation, prototyping, and testing of next generation encryption devices on cutting edge ultra-low power digital circuit boards for NSA certified key loader. Experience working with DC to DC converters for the variety of internal derived voltages needed in modern microelectronics.
$128,400 - $223,400 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.
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Knowledge of basic engineering principles as they apply to hardware design, including electronics, wire harnesses, digital computers, computer engineering, power engineering, telecommunications, control systems, robotics, radio-frequency engineering, signal processing, instrumentation, and microelectronics.
$58,300 - $133,000 a yearFull-timeExpandApply NowActive JobUpdated 4 days ago - UpvoteDownvoteShare Job
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The ATV portfolio integrates sensors, microcontrollers, high-performance memories for specific applications, power semiconductors based on silicon and silicon carbide, as well as components for human-machine interaction and vehicle connectivity.
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The Senior Mechanical Engineer leads and supports teams in the design, analysis, manufacture and test of digital, RF/analog and mixed microelectronics hardware at multiple levels of integration (chip, component, printed circuit board) across a multitude of platforms/domains.
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Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction.
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Implements digital circuit designs of varying degrees of complexity involving microelectronics and analog devices. Implements digital circuit designs of varying degrees of complexity involving microelectronics and analog devices.
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Practical experience with wire bonding for RF, Digital, or Analog/Mixed-signal applications. 5+ years of experience in process engineering, with a focus on microelectronics assembly. We're actively looking for a talented and seasoned Microelectronics Process Engineer who specializes in wire bonding.
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