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Understanding of Analog/Digital Design, microelectronics, electrical systems and Software development. The CRF is a depot repair facility for USPS mail processing, delivery, and bulk mail systems repairable parts.
$66,000 - $106,000 a yearFull-timeExpandApply NowActive JobUpdated 7 days ago - UpvoteDownvoteShare Job
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Consideration will be given to Electrical and Computer Engineering candidates with strong expertise in 1) microelectromechanical systems (MEMS); 2) photonics/optics/electro-optics; 3) RF/millimeter-wave devices and sensors; 4) hybrid bio/micro/nano devices; and 5) digital twins and computational modeling.
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In this role you’ll be exposed to cutting-edge technologies, leading cross-functional teams of engineering and manufacturing professionals to develop groundbreaking advanced microelectronics, AI/ML technologies, secure comm/networking, digital beamforming, digital signal processing, and high throughput mission processing capabilities for application in Radio Frequency (RF) systems and other complex National Security space systems for DoD/IC customers.
$184,888.41 - $195,000 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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Automotive (ATV) shapes the future of mobility with microelectronics enabling clean, safe, and smart cars – Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
$155,680 - $214,060 a yearFull-timeExpandApply NowActive JobUpdated 4 days ago - UpvoteDownvoteShare Job
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The Boeing company is seeking a Microelectronics Packaging Engineer (Mid-Level, Lead or Senior) to join our team in Huntington Beach, CA. A successful candidate will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability.
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The selected candidate will support the GXVR, Microelectronics Division with tasking from various customers including various air, land, and sea platforms at Naval Surface Warfare Center Crane located in Crane, Indiana Provide support for a system or enclave's information assurance program through security assessment and authorization activities in compliance with Risk Management Framework (RMF.
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A degree in Electrical Engineering, Physics, Microelectronics or similar. The PSS division powers decarbonization and digitalization with a wide range of energy-efficient and digital solutions.
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We are seeking hardware design engineers to join our team of digital, analog, and mixed-signal microelectronics designers involved in custom implementations and analysis of all kinds of integrated circuits.
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We are looking for a technical leader for our new Mixed Signal and Digital IC Design Capability Group (MS&DICD CG) for the FAST Labs Microelectronics Product Line. The Microelectronics team charter spans the full lifecycle from science and technology to design and development through production.
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Responsibilities:Develop digital and mixed signal test applications for package and wafer test of ASIC devices. Tektronix, a wholly owned subsidiary of Fortive Corporation, is a place where people are challenged to explore the boundaries of what’s possible, bringing the digital future one step closer every day.
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Vocational or Technical certification and 3 years' experience in one of the following trades: automation, robotics, mechatronics, microelectronics, or related trade or 5 years' experience in one of the following trades: automation, robotics, mechatronics, microelectronics, or related trade.
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Our cutting edge mixed-signal ICs may be comprised of ADCs, DACs, Fractional-N PLLs, and RF/microwave components (such as LNAs, mixers, baluns, vector modulators), and often use digital calibration techniques to meet stringent defense performance requirements.
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As part of our team, you'll serve as a strategic technical consultant to the Defense Advanced Research Projects Agency (DARPA), helping oversee the creation and execution of advanced government-funded research and development programs in application-specific integrated circuit (ASIC) microelectronics.
$65,300 - $149,000 a yearFull-timeExpandApply NowActive JobUpdated 19 days ago - UpvoteDownvoteShare Job
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Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability.
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BAE Systems Microelectronics Engineering is looking for an IC CAD/EDA tools engineer to help support our Mixed-Signal Integrated Circuit design team as we develop novel RF and mixed-signal circuits in small geometry CMOS ( Working with designers and EDA tools vendors to develop flows that to support analog, digital, mixed-signal, and EM simulations, schematic and layout entry, design analysis, and verification.
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