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Senior Packaging Engineer
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Full-time
- Technical lead for RFIC package development, supporting NPI from concept through production release.
- Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
- MS +7 or BS +10 years of experience in Materials Science, EE/ME with advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave IC's
- Proven track record of successfully driving package design/development activities from concept to implementation
- Experience in package design and development including strong understanding of relationship between materials and package performance
Expired 8 days agoInactive Job
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