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Primarily responsible for the design efforts for electro-mechanical packaging for radio frequency (RF) devices. Position utilizes CAD to design, evaluate, and solve packaging, thermal, and stress challenges related to the assembly of electronic hardware within standard and custom designed enclosures.
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Our approach uses commercial photonics foundries, which we pair with novel materials integration, additive manufacturing, sophisticated design concepts, and environmentally-rugged packaging, to realize solutions that can transition into the field.
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Work closely with other domain experts performing related functional analyses (e.g. packaging design and analysis, circuit design, thermal/mechanical analysis, etc. Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI), packaging parasitic estimation.
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As a Photonic Device Design Fellow, you will: Contribute to APL's growing photonic integrated circuit ecosystem by leading complex and novel system design efforts utilizing a variety of MPW foundries.
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We leverage our diverse set of capabilities in integrated circuit, printed circuit board (PCB), embedded software, field-programmable gate array (FPGA), and signal processing design to create ultra-small, low-power solutions that exceed comparable commercial alternatives.
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Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, the NGMC is a leader in designing, fabricating, packaging and delivering discriminating microelectronics to the military, aerospace, and commercial markets.
$199,600 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality. Experience in one or more of the following system engineering knowledge areas: technical planning, requirements derivation, functional analysis, timeline analysis, trade studies, cost and risk analysis, interface definition, system design, system integration, verification and validation, supportability, and effectiveness analyses for total systems.
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Candidates must have familiarity with the 12 IPS elements which are: Product/Program Support Management; Sustaining Engineering; Supply Support; Maintenance Planning and Management; Packaging, Handling, Storage, and Transportation (PHSandT); Technical Data (TD) Management; Support Equipment; Training and Training System Support; Manpower and Personnel; Facilities and Infrastructure; Computer Resources and Design Interface.
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Participates as a team member on product packaging design teams and performs related design functions; including equipment design and trouble shooting, analysis, and technical writing.
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One of our most challenging new fields is Microelectronics Design and Applications (MDA), which combines the unique properties of superconductivity and quantum mechanics to develop radical new energy-efficient computing systems.
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Design, develop, and implement testing methods for individual pieces of equipment (both custom and COTS) and entire systems. Working knowledge of standard design components: filters, couplers, splitters, amplifiers, etc.
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Responsible for mechanical design and development of new products, packaging design, and heat management. Job Title: Mechanical Design Engineer. 2 year degree in Mechanical Design required, 4 year engineering degree preferred.
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This includes developing project requirements, creating project timelines and reports, conducting and participating in design reviews, building and testing prototypes, creating documentation packages, and following the project through manufacturing to ensure a successful product deployment.
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