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Marvell Semiconductor, a global leader in the development and production of high-performance semiconductor technology, is seeking a seasoned Principal Packaging Engineer to join our team in Santa Clara, CA. This role is pivotal for driving innovation and excellence in our packaging engineering processes and outcomes.
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We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications.
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Experience in semiconductor technology with an emphasis on lithography, lithography simulation, or analysis tools is a plus. Support customers as a second-line engineer to field engineers to resolve customer issues.
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We seek a driven and detail-oriented Semiconductor Sales Representative to join our team. Proven track record of success in semiconductor sales or a related technical field. Familiarity with semiconductor equipment and materials, including integrated circuits, microchips, and wafer fabrication.
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As a Principal Engineer - Semiconductor at Watlow, you will play a vital role in the development and redesign of Aluminum Nitride pedestal solutions for our world leading semiconductor customers.
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You will be in the Silicon One development organization as an ASIC design verification engineer in San Jose, CA. You collaborate closely with verification engineers, designers, hardware and cross functional teams to verify the ASIC in simulation, in emulation and during ASIC bring up.
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Knowledge of JEDEC/IPC standards for semiconductor package qualifications. The team is looking for a visionary and detail oriented engineer, who can lead and execute reliability test on Main Logic Boards, identify issues with Hardware module integration through FMEA, system reliability testing, failure analysis and finally quantify the reliability of a design.
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You will be our ASIC Field Application Engineer for our US customer base. You have a high-level understanding of semiconductor technology, design methodology, EDA and IP. Define turnkey or service ASIC design project plans supporting customer requirements involving internal and/or external design, IP and implementation capabilities.
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Title: Packaging Engineer (Semiconductor) As an Client Labs Semiconductor Packaging Engineer, you will be part of the packaging team that develops Client Labs' portfolio of connectivity products in the world's leading cloud service providers and server and networking OEMs. In this role, you will need to execute on package engineering deliverables during product definition, development, qualification, initial ramp, and high-volume production.
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We are partnered up with a well-established Semiconductor organisation who enable state of the art perception for autonomous vehicles who are looking for a Signal Integrity Engineer to join their team in California.
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Principal Engineer/Technical Lead, ASIC Digital Design*, you will be leading with a small team of design engineers to develop novel SoC products for connectivity and communications. INNOPHASE *is a rapidly growing pre-IPO communications semiconductor company with headquarters in San Diego, CA, and advanced design centers in Irvine, CA, San Jose, CA, and Bangalore, India.
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Similarly, the ideal candidate would be able to strengthen quality whether the product is an individual semiconductor device, an electronic assembly (PCB/PCBA, board, hardware), or software/firmware.
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As a Packaging Engineer, you will participate in Samsung's High-end Advanced Packages, mainly, Design and Electrical Analysis (SI/PI) for high bandwidth and low power Advanced Packaging (ex: SiP, 2.5D, 3D, 3.5D, etc.
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Proficiency in the development and design of plasma and/or thermal CVD/ALD semiconductor reactor components (e.g., high temp wafer heaters, gas distribution showerheads, electrostatic chucks, wafer lift mechanisms, bellows, etc.
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Employer will accept a Bachelor's degree in Computer Science, Electrical Engineering, Electronics Engineering or related field and followed by five years of progressive, post-baccalaureate experience in job offered or in a Principal ASIC Design Verification Engineer-related occupation.
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