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Celestial AI, a trailblazer in cutting-edge technology at the intersection of photonics, packaging, and advanced manufacturing, is actively seeking a seasoned Mechanical Engineer to join our innovative team.
$150,000 - $180,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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As a millimeter-wave IC design engineer, you will be the owner of providing circuit and system solutions for multi-gigabit wireless chips! Responsibilities include: Collaborate with platform architects, system engineers, and digital design groups to define the requirements for mmWave phased-array front-end and baseband blocks based on the product requirements.
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Veeco's process equipment solutions enable the manufacturing of LEDs, displays, power electronics, hard drives, compound semiconductors, MEMS, semiconductors advanced packaging and wireless chips.
$130,000 - $164,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Design, simulate and validate advanced RF/mmWave packaging/module solutions. MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. In depth knowledge in electromagnetics, RF filters, PA and LNA design.
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The electronics packaging engineer for battery pack design is critical to the Energy Storage System (ESS) development process, including conceptual designs, components selection, prototype builds, and launch designs for volume manufacture.
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Proven leadership capabilities in a multi-cultural and cross-functional team environmentThis role will leverage a broad cross-domain technical background, some desired areas of expertise include: PDK based technology evaluation ASIC, SOC and/or IP design EDA tools, flows and methodologies FAB, packaging, and product test Foundry experience as direct customer technical interface is a plus.
$123,139 - $203,801 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Senior IC Layout Design Engineer page is loaded. Layout design of high precision analog / mixed signal circuits subject to multiple constraints. -Minimum four years of experience in layout design of high precision analog / mixed signal circuits in deep submicron process.
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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelor’s degree in Computer Science, - Design PCB schematic, layout and perform circuit and 3D EM simulation.
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Experience taking projects from the concept phase, through chip architecture, writing electrical specifications, process technology selection, die size estimation, managing schedules, IC design, layout supervision, layout extraction and verification, DRCs, LVS, LVL, mask and wafer fabrication monitoring, ATE lab correlation, corner lot characterization analysis, hands-on lab evaluation, release to production, yield improvement, and failure analysis support.
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Understanding of ArtiosCAD, CAPE/TOPS, or other packaging design software. Own engineering development and execution of final packaging design concepts. Collaborate with Industrial Design, Hardware Engineering, Operations, and Technical Program Management to provide engineering support for packaging development.
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With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient, and sustainable source of supply.
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Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers.
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Candidate should possess a solid understanding of mixed-signal ASIC design and related packaging technologies, as well as practical knowledge of semiconductor technology processes, devices, and associated performance limiters.
$167,980 - $279,970 a yearFull-timeExpandApply NowActive JobUpdated 7 days ago - UpvoteDownvoteShare Job
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Strong portfolio of cutting edge retail packaging design that proves not only solid design skills but forward-thinking in consumer electronics or related industry. 5-7+ years of relevant experience in structural packaging design.
$78,000 - $178,200 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Work closely with IC design teams to define package design rules and define packages to meet their requirements. Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules.
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packaging design jobs in Santa Clara, CA
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