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Architect re-usable DFT strategies that can be used across generations of similar ASICs and possible different packaging options. Drive the entire DFT cycle of the ASIC including but not limited to test insertion, test coverage assessment, and at-speed testing, accompanied by implementation knowledge of test pattern development, scan compression, JTAG, IJTAG, Memory BIST and Logic BIST.
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This opportunity will focus on active and passive power delivery enhancements and signal routing strategies for high performance in the leading packaging technologies and semiconductor processes.
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Guide the package and PCB design teams to account for signal integrity considerations. You will work closely with IP, SoC Design, Package Design, Signal Integrity and Systems teams throughout the company as well was interact with leading worldwide technology partners.
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Silicon Photonics / Optical Packaging Engineer Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrate into short distance within the boards.
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The ideal candidate will have experience in chemical and environmental regulatory compliance, packaging regulatio ns, product stewardship and industrial risk management in the medical device or manufacturing industries.
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General familiarity and interest in frontend development, including: Languages: JavaScript/Typescript/HTML/CSS Frontend frameworks: React/Vue/Angular Packaging frameworks: Webpack/Rollup/BaBel/AST/Gulp- Familiar with key concepts like functional and asynchronous programming, closures and types, layouts, specificity, animation, cross browser compatibility, data security and accessibility.
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Working knowledge of Cadence Allegro Packaging Design (APD) Working knowledge of Cadence Allegro Packaging Design (APD) Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules.
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Direct experience in the development of high voltage (300 – 800 V) electromechanical systems, including creepage and clearance, dielectric isolation, cost-optimized packaging, harness design and routing, laser welding, thermal and mechanical analysis, and PCBA mechanical packaging.
$182,000 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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We also formed Blue Polymers, a joint venture with Ravago, to develop facilities that will further process plastic material from our Polymer Centers to help meet the growing demand for sustainable packaging.
$152,020 a yearFull-timeExpandApply NowActive JobUpdated 8 days ago - UpvoteDownvoteShare Job
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Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.
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Repairs/seals damaged packaging and boxes including peg-hook items. Operates store equipment as needed depending on one specific role and department (e.g., Zebra phone, telephone, paging system, copiers, fax machines, computers, CCTV surveillance system, key cutter, panel saw, paint mixer, flooring cutters, compacter baler.
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We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.
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The Graphic Communication Division of FUJIFILM North America Corporation is the largest graphic distributor in the US. We deliver world class, state of the art solutions for Ink Jet Printing, Digital Printing, Wide Format, Offset Plates, Packaging, and a full range of traditional Offset supplies.
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Job will require frequent interaction with fab, test and reliability engineering, packaging and system engineering groups, as well as with product engineering personnel. Job RequirementsExperience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devicesExperience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
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KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. Our comprehensive services include: proactive management of tools to identify and improve performance; expertise in optics, image processing and motion control with worldwide service engineers, 24/7 technical support teams and knowledge management systems; and an extensive parts network to ensure worldwide availability of parts.
$325,700 a yearFull-timeExpandApply NowActive JobUpdated Today
packaging job Title: early morning Company: Mcdonalds Restaurants in San Jose, CA
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