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Silicon Photonics / Optical Packaging Engineer Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrate into short distance within the boards.
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This opportunity will focus on active and passive power delivery enhancements and signal routing strategies for high performance in the leading packaging technologies and semiconductor processes.
$264,557 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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The ideal candidate will have experience in chemical and environmental regulatory compliance, packaging regulatio ns, product stewardship and industrial risk management in the medical device or manufacturing industries.
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General familiarity and interest in frontend development, including: Languages: JavaScript/Typescript/HTML/CSS Frontend frameworks: React/Vue/Angular Packaging frameworks: Webpack/Rollup/BaBel/AST/Gulp- Familiar with key concepts like functional and asynchronous programming, closures and types, layouts, specificity, animation, cross browser compatibility, data security and accessibility.
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Working knowledge of Cadence Allegro Packaging Design (APD) Working knowledge of Cadence Allegro Packaging Design (APD) Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules.
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We also formed Blue Polymers, a joint venture with Ravago, to develop facilities that will further process plastic material from our Polymer Centers to help meet the growing demand for sustainable packaging.
$152,020 a yearFull-timeExpandApply NowActive JobUpdated 8 days ago - UpvoteDownvoteShare Job
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Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.
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Direct experience in the development of high voltage (300 – 800 V) electromechanical systems, including creepage and clearance, dielectric isolation, cost-optimized packaging, harness design and routing, laser welding, thermal and mechanical analysis, and PCBA mechanical packaging.
$182,000 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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Working with a multi-disciplinary team across the company through the full life cycle of product development, including RF design, packaging, product, and test engineering. The successful candidate will possess an RF design background with an excellent understanding of wireless markets and associated IC and MCM technology required to meet cutting edge product requirements.
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We have the capabilities needed to bring products to full production, including assembly, packaging and testing, and in-house sterilization. We are actively looking for a Principal Mechanical Engineer who can bring innovation and creative thinking to the team.
$170,000 a yearFull-timeExpandApply NowActive JobUpdated 18 days ago - UpvoteDownvoteShare Job
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We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.
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At least 5 years industry experience with optical transceiver assembly, silicon photonics, and optical and IC packaging. Knowledge and experience in optical coupling efficiency, signal integrity, and thermal modeling are great advantages.
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The Graphic Communication Division of FUJIFILM North America Corporation is the largest graphic distributor in the US. We deliver world class, state of the art solutions for Ink Jet Printing, Digital Printing, Wide Format, Offset Plates, Packaging, and a full range of traditional Offset supplies.
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Description Are you a Materials Handler that is looking to join one of the top companies within semiconductor manufacturing industry?
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Job will require frequent interaction with fab, test and reliability engineering, packaging and system engineering groups, as well as with product engineering personnel. Job RequirementsExperience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devicesExperience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
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packaging job Title: early morning Company: Mcdonalds Restaurants in Milpitas, CA
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