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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelors degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent.
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Title: RF/mmWave Packaging Engineer. Education: MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. Design, simulate and validate advanced RF/mmWave packaging/module solutions.
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Pebble is an electric vehicle startup defining a new way to live, work and explore from anywhere with a 100% electric, hassle-free RV. Built by a team of experts in both automotive and consumer technology, Pebble combines electrification with cutting-edge automotive technology for an RV experience that removes the hassles RV owners have struggled with for decades.
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As an Astera Labs Senior Semiconductor Packaging Engineer , you'll be developing connectivity products for leading cloud service providers and server/networking OEMs. Your primary focus will be utilizing your expertise in signal and power integrity to optimize package and system-level performance.
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We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation.
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The Advanced Packaging team within AO is responsible for Package Design and various Product Packaging process steps, including wafer scale heterogenous integration and component level packaging, while working closely with our module and line card Packaging teams.
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This individual is a self-driven leader that will drive Semiconductor process development (Wafer foundry and Packaging) / quality improvements as well as Program Management methodologies and systems during NPI, ramp up and mass production working with Semiconductor component suppliers, System integration sites and a broad range of Apple internal Engineering, Product Quality, Business Management and other cross functional teams.
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Learn all about the Chick-fil-A process, from breading and frying, to boxing and sending. Chick-fil-A routines and quality standards, while cooking and packaging our products. Learn all about the Chick-fil-A process, from breading and frying, to boxing and sending.
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Load filler with appropriate product lids, cups, and box labels as required by production and packaging of product. Replenishes packaging supplies such as film, boxes, cartons, glue, ink, labels , etc.
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We are seeking a Principal /Staff RF Packaging Engineer to join one of the leading optical transmission R&D teams in the world. Perform analog signal integrity simulation and design for high speed ceramic packages, high speed optical and electrical components and submounts, high speed PCB circuits and the RF chain link performance.
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Minimum experience 8 years in semiconductor packaging technology. Work closely with IC design teams to define package design rules and define packages to meet their requirements. Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules.
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In photonics, the packaging design is as crucial as the photonic integrated circuit (PIC) design. 5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.
$75,000 - $200,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Working knowledge in Microsoft environments, System Center Configuration Manager (SCCM), Active Directory, PowerShell, Intune/MDM, App-V and Software Packaging (MSI) a huge plus. Working knowledge in Microsoft environments, System Center Configuration Manager (SCCM), Active Directory, PowerShell, Intune/MDM, App-V and Software Packaging (MSI) a huge plus.
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Minimum experience 12 years in semiconductor packaging technology. Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus. Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages.
$190,000 - $200,000 a yearFull-timeExpandApply NowActive JobUpdated 14 days ago - UpvoteDownvoteShare Job
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Mechanical Design - Electronic Packaging System Design, Sensors/Moving Parts, Review FEA, Review Mold Flow Analysis, Tolerance Analysis, Mechanical Components & Commodities, Mechanical Assembly, DFAssembly, DFM-Manufacturing, DFAssembly, FMEA.
$149,100 - $191,700 a yearFull-timeExpandApply NowActive JobUpdated 3 months ago
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