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Senior Signal Integrity Engineer
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Full-time
- The Advanced Packaging team within AO is responsible for Package Design and various Product Packaging process steps, including wafer scale heterogenous integration and component level packaging, while working closely with our module and line card Packaging teams.
- As a Senior Signal Integrity Engineer, you would be responsible to design the chain of interconnects for Nokia's fiber-optic transceiver products.
- Own the high-speed Signal Integrity (SI) through all electro-optic components in our transmit and/or receive optical front-end modules, including PICs, RFICs, substrates and other package elements.
- Drive cross-functional discussions to analyze the full signal path from DSP ASIC, through the RF interface to the module, followed by the driver/TIA and Silicon-Photonic Integrated Circuit.
- Run simulations for RF radiation effects and other electromagnetic interference (EMI) issues between the multiple high-speed signals, high-resolution DAC/ADC signals and digital control signals (e.g., SPI).
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