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Title: RF/mmWave Packaging Engineer. Education: MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. Design, simulate and validate advanced RF/mmWave packaging/module solutions.
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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelors degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent.
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Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM.Participates early on Si/package/PCB/system co-design, and ODM SMT manufacturing work in product development design reviews providing feedback on manufacturability and helps incorporate latest technology advancements and design rules.
$170,000 - $240,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Pebble is an electric vehicle startup defining a new way to live, work and explore from anywhere with a 100% electric, hassle-free RV. Built by a team of experts in both automotive and consumer technology, Pebble combines electrification with cutting-edge automotive technology for an RV experience that removes the hassles RV owners have struggled with for decades.
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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
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The Advanced Packaging team within AO is responsible for Package Design and various Product Packaging process steps, including wafer scale heterogenous integration and component level packaging, while working closely with our module and line card Packaging teams.
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You will be part of a cross-functional team of silicon photonics, analog, packaging, and system engineers who will drive various laser module developments from concept to high-volume production.
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Our team is working across the full stack of quantum computing, from quantum architecture to photonic chip manufacturing, advanced opto-electronic packaging, hardware systems design, quantum algorithms and software tools, and cryogenic cooling.
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MS or PhD in EE with emphasis on advanced packaging or RF design. Experience in RF design and RF advanced packaging technologies. You should have deep experience in RF module development, SIP and RF advanced packaging for consumer electronics along with a passion for exploration and experimentation.
$170,000 - $240,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Experience with advanced packaging technologies and RF module/SIP design. · Design, simulate and validate advanced RF packaging/module/SIP. · Evaluate new advanced packaging technology, including design and validation of prototypes.
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Desired: Familiarity with some of the following: semiconductor subsystems, lasers/photonics, packaging technologies, advanced testing, systems engineering, or cryogenic systems. Our team is working across the full stack of quantum computing, from hardware design, manufacturing, and packaging through to quantum architecture and quantum algorithms.
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Setup and operate all woodworking tools and machines required to cut, shape, drill and sand material to size including selection and installation of proper cutting tools or abrasives. Perform tenant improvement renovations including installation/modification of demountable wall systems, modular partition/furniture systems, office partitions, raised-floor systems, drop ceilings, acoustic panels, weather-stripping, window coverings, wall fans or air conditioning units and mounted office accessories.
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We strive to balance heating/cooling performance, energy consumption, cost, reliability, NVH, and packaging trade-offs through physics-driven, cross-functional engineering collaboration. Knowledge of microcontroller peripherals such as ADC, GPIO, PWM, and SPI, and experience in sensors and digital signal processing.
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In depth knowledge in electromagnetics, RF filters, PA and LNA design. Design PCB schematic, layout and perform circuit and 3D EM simulation. At least BSEE or BSc in related engineering discipline. Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
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Manage installation and infosec review process and questionnaires for new customers and track any remediation activities to closure. Credentialing from the American Registry of Radiologic Technologists (ARRT) in Computed Tomography or the American Board of Imaging Informatics (ABII) a plus.
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assembler packaging installation jobs in Palo Alto, CA
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