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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelors degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent.
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Role: Lead Mechanical Engineer. We are seeking an experienced Mechanical Design Engineer to join our dynamic startup in disrupting mobility and living space. Bachelor's degree in Mechanical Engineering, Automotive Engineering, or a related field.
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Title: RF/mmWave Packaging Engineer. Education: MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. Design, simulate and validate advanced RF/mmWave packaging/module solutions.
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Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM.Participates early on Si/package/PCB/system co-design, and ODM SMT manufacturing work in product development design reviews providing feedback on manufacturability and helps incorporate latest technology advancements and design rules.
$170,000 - $240,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Design camera module structures and packaging in CAD. - Design injection molded, sheet metal, PCB, and other component parts. - Having experience with electro-mechanical design for camera is a definite plus.
$138,900 - $256,500 a yearExpandUpdated 14 days ago - UpvoteDownvoteShare Job
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As an Astera Labs Senior Semiconductor Packaging Engineer , you'll be developing connectivity products for leading cloud service providers and server/networking OEMs. Your primary focus will be utilizing your expertise in signal and power integrity to optimize package and system-level performance.
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MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design. Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
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Perform package design for ARVR custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM. Key Skills : Experience in Cadence APD, Experience in silicon packaging co design and workflow, bump map and ball map optimizations.
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The Advanced Packaging team within AO is responsible for Package Design and various Product Packaging process steps, including wafer scale heterogenous integration and component level packaging, while working closely with our module and line card Packaging teams.
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Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
$150 - $200ExpandApply NowActive JobUpdated 9 days ago - UpvoteDownvoteShare Job
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Understanding of packaging thermals and mechanical considerations, such as heat transfer and mechanical strain and stress. You will be part of a cross-functional team of silicon photonics, analog, packaging, and system engineers who will drive various laser module developments from concept to high-volume production.
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Solve electronics packaging issues including: electrical isolation, sealing, thermal management, interconnection, shock and vibration management, electromagnetic interference (EMI), RF communications, etc.
$80,000 - $300,000 a yearFull-timeExpandApply NowActive JobUpdated 3 months ago - UpvoteDownvoteShare Job
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Celestial AI, a trailblazer in cutting-edge technology at the intersection of photonics, packaging, and advanced manufacturing, is actively seeking a seasoned Mechanical Engineer to join our innovative team.
$150,000 - $180,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Our team is working across the full stack of quantum computing, from hardware design, manufacturing, and packaging through to quantum architecture and quantum algorithms. The Photonic Engineer will work closely with other teams withing PsiQuantum (electronics, manufacturing, test, packaging and system validation) to achieve these goals.
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Direct experience in the development of high voltage (300 – 800 V) electromechanical systems, including creepage and clearance, CTI, cost-optimized packaging, harness design and routing, laser welding, thermal analysis, and PCBA mechanical packaging.
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packaging job Title: mechanical technician Company: Inficon in Mountain View, CA
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