Career Accelerator Program - Packaging Engineer

Overview In this role you will support TI's packaging engineering efforts within the TMG Development program, partnering across teams to design and qualify advanced packages. You will apply modeling, experiments, and material selection to improve reliability and performance of packaging tech. You’ll work in a fast-paced environment that values collaboration and impact, helping TI differentiate through miniaturization, high reliability, and low power. This is a hands-on, cross-functional role with a clear path for growth and learning. Compensation / Benefitscompetitive pay and benefitsemployee well-being focuscountry-specific benefits ResponsibilitiesCollaborate with businesses to design and develop packaging solutions (Wirebond, Flip Chip, Modules, SIPs) across readiness stagesParticipate in cross-functional teams to support product qualification, production, reliability, and yield targetsPlan and conduct design-of-experiments and work with material suppliers to select materials improving reliability and performanceConduct electrical, mechanical, and thermal analyses to understand silicon-to-package interactions, establish design rules, and mitigate high-risk designs Key requirementsBachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or relatedCumulative GPA 3.0/4.0 or higherAbility to work in teams and collaborate across functionsStrong written and verbal communication skillsStrong time management and initiative to drive resultsAbility to build influential relationships and thrive in a fast-paced, changing environmentNo visa sponsorship for this positioncollaborationproblem solvingeffective communicationsemiconductor packaging knowledge (manufacturing, assembly, reliability, materials)statistical process control (SPC) understandingdesign-of-experiments (DOE)