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This individual is a self-driven leader that will drive Semiconductor process development (Wafer foundry and Packaging) / quality improvements as well as Program Management methodologies and systems during NPI, ramp up and mass production working with Semiconductor component suppliers, System integration sites and a broad range of Apple internal Engineering, Product Quality, Business Management and other cross functional teams.
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In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics and material science. You have strong understanding of semiconductor process integration and process development.
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1 years of experience in process integration or defect reduction roles in silicon photonics or other semiconductor technologies. Job Description As a Silicon Photonics (SiP) Process Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products.
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You have a strong functional knowledge of semiconductor device physics and materials science. Responsibilities include, but not limited to:Lead technology integration activities to enable state-of-the-art 3D DRAM, working on device components such as charge storage devices and thin-film transistors (TFTs), among others.
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Hands-on semiconductor wafer fabrication process and process integration challenges. Semiconductor device physics and defect mechanism knowledge. Minimum Qualifications: MSc in Materials Science, Chemistry, Chemical Engineering, Physics, photonic devices, or related fields 2 years of relevant engineering experience in semiconductor fab process or device characterization or yield, or reliability, or test/validation.
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Understanding of circuit design techniques, semiconductor device physics, signal processing, RF/ microwave engineering, or measurement techniques for high-bandwidth and high fidelity analog signals.
Starting at $128,900 - $157,900 (bonuses)ExpandApply NowActive JobUpdated 3 months ago - UpvoteDownvoteShare Job
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9+ years' experience in advanced node semiconductor industry in Device Integration. As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art.
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You will lead innovation and development of novel 2.5D and 3D semiconductor integration processes with TFLN for high-speed electro-optic applications. We are a driven and forward-thinking team with extensive experience in design, engineering, scalable manufacturing, integrated photonics technologies, nanofabrication, device physics, and process development in semiconductor materials.
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Advanced Understanding of semiconductor wafer processing, device physics and product engineering. We are seeking a Process Integration Engineer which expertise in mass production, capable of comprehensively understanding CMOS integration processes and device physics.
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In depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies.
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Integration of equipment into OSI PI system via OPC-DA , OPC-UA, PI RDBMS, PI UFL. Capgemini Engineering has more than 55,000 engineer and scientist team members in over 30 countries across sectors including Aeronautics, Space, Defense, Naval, Automotive, Rail, Infrastructure & Transportation, Energy, Utilities & Chemicals, Life Sciences, Communications, Semiconductor & Electronics, Industrial & Consumer, Software & Internet.
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We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc.
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Semiconductor device integration, process development: prior experience as intern/co-op at a 300mm semiconductor FAB is a plus. We are seeking a BEOL semiconductor integration engineer, who will be working with a world class team on research and development of the most advanced technology nodes, continuously pushing the boundary of logic technology with partners and clients worldwide.
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This position needs to optimize manufacturing processes, to support product development, to ensure quality control, to facilitate technology transfer, to drive continuous improvement, and to collaborate across teams to produce high-quality semiconductor products.
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We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Work with cross-functional teams and lead package integration and architecture efforts.
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