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IC Package Integration Engineer
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$150 - $200
- We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development
- Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent communication skills that enable the candidate to work well with internal cross-functional teams and overseas suppliers
- Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity/power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost
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