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Job Description As a Silicon Photonics (SiP) Process Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products.
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As an Advanced Modeling Engineer/Technologist at Micron, you will employ techniques and theories drawn from areas of computational geometry, semiconductor science, materials science, and engineering to build predictive models and provide concrete insights and solutions.
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Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world.
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Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
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The Principal Systems Engineer will be an experienced RF and Analog/Mixed Signal hardware engineer who is adept at system design and analysis in support of Mobile Wireless Communications, and other applications such as Wireless Infrastructure, Wi-Fi, and Broadband Communications.
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Electronics Manufacturing, Robotics, Semiconductor Test, Industrial Automation, Production Board Test, System Level Test, Storage Test, Wireless Test, and Memory Test. The Semiconductor Test Division is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal and memory technologies.
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In-depth knowledge of wafer fabrication processes, packaging technologies, and semiconductor device physics. We are hiring an accomplished Reliability Engineer Manager with over 10 years of extensive expertise in Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) reliability within the realm of nanometer technology, encompassing bulk Si and SOI. Will lead reliability assessments at multiple levels, including the wafer, package, discreet devices, and product levels.
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You will deliver Dry etch process and HW solutions to meet Micron’s program requirements while driving dry etch technology roadmaps to continue enabling Micron’s global leadership in semiconductor manufacturing.
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A working understanding of MEMS or semiconductor device physics and fabrication. In this role you will be the lead engineer ensuring technical attainment of all qualification requirements, including characterization and reliability testing, and drive the timely release-to-production.
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Experience leading the development of tools used in semiconductor manufacturing. Semiconductor or Special Purpose Machine design experience preferred. mechanical design engineer.
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Required expertise/ knowledge includes:Understanding of power electronics and DC-DC converters including control theory, analog circuit design, power semiconductor switch design, and magnetics design.
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Component Reliability Engineer – Semiconductor Electronics. Expertise in reliability engineering (including failure analysis) for semiconductor-based electronics. 5+ years of experience in this field, with strong familiarity with semiconductor manufacturing processes, different fab technologies and package assemblies.
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Field Service Engineer - Semiconductor Equipment page is loaded. Field Service Engineer - Semiconductor Equipment. KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem.
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M.S. in Engineering, Materials Science, Chemistry, Physics or other relevant engineering or physical science discipline with 2 years of Semiconductor Manufacturing experience. Minimum of 4 years of Semiconductor Manufacturing experience in 300mm Wafer Fabrication.
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Hands on Sustaining Sr. Semiconductor Packaging Assembly Process Engineer Lead to work for a High-Tech semiconductor Manufacturer in the Tucson, Area. Sr. Semiconductor Packaging Assembly Process Engineer Lead will ensure stable, robust, repeatable, sustainable and high yielding manufacturing processes and products are achieved, monitored and maintained.
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