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Familiarity with the following packaging and interconnect technologies/processes: Chip Scale Packaging, BGA Packaging, Multi-Chip Module Packaging, High Density Interconnect, Stacked Die Interconnect, Flip Chip Interconnect, Wirebonding, Redistribution Layers (RDL), Fan-Out-Wafer-Level Packaging (FOWLP), SMT Assembly, Thermal Compression Bonding, Gold Stud Bump Bonding, Low Stand-Off Underfilling, Wafer-to-Wafer and Die-to-Wafer Bonding.
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This person should have extensive SMT experience with exceptional hand soldering skills, the ability to run pick-and-place machines and reflow ovens as well as experience with mechanical assembly and cable harness assembly.
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Familiar with various electronics manufacturing processes (such as SMT, PCB fabrication, polymerics application, solder chemistries, etc). An Electronics Packaging Engineer in the Special Projects division applies their engineering knowledge in the areas of 3D CAD design, GD&T, heat transfer, design for manufacturability, structural mechanics, composite materials, radome design, material properties, and other engineering design principles to various electronics packaging projects serving the Intelligence community.
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This person should have extensive SMT experience with exceptional hand soldering skills, the ability to run pick-and-place machines and reflow ovens, and experience with mechanical assembly and cable harness assembly.
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Northrop Grumman's Manufacturing Operations Engineering organization is seeking an Associate Manufacturing Process Engineer (T1) or a Manufacturing Process Engineer (T2) Manual Operations area for the Surface-Mount Technology (SMT) cell.
$62,600 - $113,500 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Assembler, Cleanroom, Assembly, Production, Microscope, pcbs, printed circuit boards, electronic assembly, smt, smt soldering, production assembler, electromechanical assembly, solder. assembler, Cleanroom, Assembly, Production, Microscope, pcbs, printed circuit boards, electronic assembly, smt, smt soldering, production assembler, electromechanical assembly, solder.
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Northrop Grumman Mission Systems is seeking a SMT & Subarray Material Process Specialist 1 to join its organization. With directions from Engineering, develop process improvements and ensure processes in the SMT and Subarrray areas are running at the optimal levels for continued production.
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Have experience with electronic assembly including; SMT, T/H & Mechanical. These solutions include product design, printed circuit board layout, test development, and manufacturing support through the whole product lifecycle.
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Experience with CNC and SMT processes is preferred. Forecast needs, and design Quality Systems, Processes, and QMS improvements based on selected Quality Models. Proven familiarity with Electro-Mechanical manufacturing and assembly lines.
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Supporting factory maintenance personnel with the troubleshooting and repair of process equipment. Experience with soldering, connections, building microelectronics and computers. Specifying, identifying and procuring new manufacturing equipment for production readiness and preparing equipment for production with a focus on the machine integration and data collection.
$62,600 - $113,500 a yearFull-timeExpandApply NowActive JobUpdated Yesterday - UpvoteDownvoteShare Job
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Proficiency in soldering techniques, including through-hole soldering, surface mount technology (SMT), and rework/reflow soldering. Proficiency in soldering techniques, including through-hole soldering, surface mount technology (SMT), and rework/reflow soldering.
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