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The Senior Mechanical Engineer leads and supports teams in the design, analysis, manufacture and test of digital, RF/analog and mixed microelectronics hardware at multiple levels of integration (chip, component, printed circuit board) across a multitude of platforms/domains.
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In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Backgrounds such as Cybersecurity, SIGINT, hybrid-cloud, machine learning (ML), artificial intelligence (AI), integrated network architecture, information technology infrastructure and hybrid-communications all have a place in the spectrum of implementations ranging from commercial/government off-the-shelf solutions to the development of new and unique technologies.
$81,233 - $183,500 a yearFull-timeExpandApply NowActive JobUpdated 9 days ago - UpvoteDownvoteShare Job
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NGATLBasic Qualifications:Bachelor’s degree in Electrical Engineering or Microelectronics Engineering with 9 years of related experience or a Master's Degree with 7 years of experience or PhD with 4 years of related experienceDirect semiconductor RF test engineering experienceDirect experience in leading a team of engineersBe able to obtain and maintain a U.S. Government security clearance (U.S. citizenship is a pre-requisite)Software skills in a modern language such as C#, Python, C.
$127,000 - $190,600 a yearFull-timeExpandApply NowActive JobUpdated 5 days ago - UpvoteDownvoteShare Job
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The Engineering & Sciences organization supporting the Microelectronics Design and Applications business area at Northrop Grumman Mission Systems (NGMS) is looking for a Manufacturing Systems Engineer to join our team based out of Linthicum, MD or Annapolis Junction.
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Expertise in microelectronics/semiconductor fabrication and advanced packaging: physical/chemical vapor deposition; dielectrics (including spin-on dielectrics), metals, superconducting materials, dry/wet etch processing, photolithography, failure analysis, semiconductor metrology, CMP, FEOL/BEOL, semiconductor product development, process control and sustainment.
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We are actively seeking a Hybrid Assembly and Microelectronics Packaging Engineer, for the Advanced Electrical Fabrication Group. As a Hybrid Assembly & Microelectronics Packaging Engineer.
ExpandApply NowActive JobUpdated 6 days ago - UpvoteDownvoteShare Job
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You will be responsible for hands-on microelectronics and hybrid assembly work, especially with a new process or assembly. This is a unique opportunity to apply a passion for microelectronics packaging toward advanced prototypes and one-of-a kind systems that will further the scientific knowledge of humankind, safeguard our nation's security, and advance the frontiers of space.
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Some of the types of systems we develop include but are not limited to: RF communications Position, navigation, and timing (PNT) Microelectronics (including custom ASIC development and packaging) Sensor systems (audio, image, motion, etc.
ExpandApply NowActive JobUpdated 3 days ago - UpvoteDownvoteShare Job
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Your primary responsibility will be to interface with electrical and mechanical engineers from around the Laboratory, develop process plans and technical capabilities to build their hardware, and be hands on while leading the hardware development through the surface mount electronics fabrication and microelectronics assembly fabrication area.
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Experience working with DC to DC converters for the variety of internal derived voltages needed in modern microelectronics. Design, documentation, implementation, prototyping, and testing of next generation encryption devices on cutting edge ultra-low power digital circuit boards for NSA certified key loader.
ExpandApply NowActive JobUpdated 11 days ago - UpvoteDownvoteShare Job
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Microelectronics Engineering, integrated circuit design and integrated circuit reverse engineering skills. Our team specializes in vulnerability analysis and research, system emulation, software engineering, reverse engineering, embedded development, and cyber security.
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As an Electronics & Microelectronics Manufacturing Engineer you will. Serve as the expert in microelectronics assembly designing assembly workflows, as well as adjusting current workflow to meet sponsor's requirements.
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Operating industrial/production equipment, machinery (Lathes, CNC, EDM, Mills, Waterjet, Welder, Industrial Printers, Routers, 3D Printers, Electro Plating, Vacuum Casting/Forming, Injection Molding, Industrial Painting/Finishing, and Textile) and tools such as machine tools, presses, air compressors, and packaging equipment.
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Top Secret Clearance with Full Scope Poly. The consulting and facilitation services are as-needed from subject-matter experts to facilitate Technical Exchange Meetings (TEM), Technical Information Meetings (TIM), Strategy offsites, develop the strategic plan, conduct strategic and performance management, and guide strategic alignment.
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