Application Engineer - 3D IC / Advanced Packaging

This role requires fluency in Mandarin Chinese for daily collaboration with our R&D teams.Key Responsibilities:1. Provide technical support for the company’s EDA products; deeply understand customer requirements and actively drive product competitiveness.2. Deliver electromagnetic (EM) modeling and simulation support for advanced packaging scenarios (including 2.5D IC, 3D IC, and Chiplets) using the company's toolsets.3. Utilize and master industry-standard electromagnetic simulation tools to solve customer design challenges.Qualifications:1. Master’s degree or above in RF, Microwave, Communications Engineering, Electrical Engineering, Microelectronics, or a related technical discipline.2. Hands-on experience in EM simulation and design for 2.5D/3D IC technologies (e.g., CoWoS, Interposers).3. Proficiency in at least one mainstream EM simulation tool (e.g., HFSS, Clarity, EMX, etc.).4. Strongly Preferred: Direct experience with TSV, DTC, Interposer, and Hybrid Bonding technologies.5. Preferred: Prior experience collaborating with semiconductor Foundries.Additional Information:Locations: Wuhan, Beijing, Shenzhen, ShanghaiWork Mode: Remote work options are available and supported.CompensationSalary will be commensurate with experience and finalized in accordance with the company's compensation structure and grading system.