Computational Electromagnetics (CEM) Algorithm Engineer – DC & Thermal（FEM）

This role requires fluency in Mandarin Chinese for daily collaboration with our R&D teams.About the RoleWe are seeking a highly skilled Computational Electromagnetics (CEM) Algorithm Engineer to spearhead the development of the DC module for our next-generation electromagnetic simulation software. This role focuses on the intersection of advanced numerical methods, multi-physics coupling, and high-performance computing (HPC) to solve complex electro-thermal challenges in semiconductor packaging and PCB design.Key Responsibilities1. Algorithm R&D: Lead core algorithm research and design for the DC module. Develop electro-thermal coupling mathematical models based on Finite Element Methods (FEM), covering IR Drop analysis, current density distribution, and steady-state/transient thermal (temperature field) simulations.2. Numerical Solver Development: Architect and optimize numerical solvers using C++ and high-performance libraries (e.g., Intel MKL, MUMPS). Focus on enhancing the computational efficiency and convergence of large-scale sparse matrix computations.3. HPC Architecture: Design and implement high-performance computing frameworks. Research and deploy Domain Decomposition Methods (DDM) and distributed computing strategies (MPI) to enable cross-node parallel processing for ultra-large-scale models.4. Multi-physics Coupling: Investigate electro-thermal co-simulation theories. Optimize the coupling mechanisms between Joule heating and heat conduction equations to ensure high physical fidelity and numerical stability.5. IP & Documentation: Produce high-quality technical documentation and contribute to patent applications. Lead the resolution of critical technical bottlenecks in solver development.Qualifications1. Education: Master’s degree or PhD in Computational Mathematics, Electromagnetics, Microwave Technology, Electrical Engineering, or a related field.2. Foundational Knowledge: Strong grasp of computational electromagnetics, including Maxwell’s equations, Kirchhoff’s laws, and finite element discretization techniques.3. Numerical Analysis: Solid background in numerical analysis. Proven experience with Intel MKL, MUMPS, or similar libraries for sparse linear algebra and HPC.4. Parallel Computing: Hands-on experience with Domain Decomposition Methods (DDM) or distributed parallel computing (e.g., MPI/OpenMP) is highly preferred.5. Industry Experience: Familiarity with commercial tools such as Ansys PowerDC or SIwave is a plus. Experience with PCB/IC package Power Integrity (PI) and thermal analysis workflows is highly desirable.6. Technical Acumen: Strong algorithmic thinking with the ability to independently design, verify, and troubleshoot complex numerical algorithms.7. Language: Proficiency in English technical reading and writing; ability to publish technical papers or patents is a plus.LocationsWuhan/ Shanghai/ShenzhenCompensationSalary will be commensurate with experience and finalized in accordance with the company's compensation structure and grading system.