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Silicon Photonics / Optical Packaging Engineer Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrate into short distance within the boards.
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This opportunity will focus on active and passive power delivery enhancements and signal routing strategies for high performance in the leading packaging technologies and semiconductor processes.
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Our team is working across the full stack of quantum computing, from quantum architecture to photonic chip manufacturing, advanced opto-electronic packaging, hardware systems design, quantum algorithms and software tools, and cryogenic cooling.
$182,000 a yearFull-timeExpandApply NowActive JobUpdated Yesterday - UpvoteDownvoteShare Job
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General familiarity and interest in frontend development, including: Languages: JavaScript/Typescript/HTML/CSS Frontend frameworks: React/Vue/Angular Packaging frameworks: Webpack/Rollup/BaBel/AST/Gulp- Familiar with key concepts like functional and asynchronous programming, closures and types, layouts, specificity, animation, cross browser compatibility, data security and accessibility.
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The ideal candidate will have experience in chemical and environmental regulatory compliance, packaging regulatio ns, product stewardship and industrial risk management in the medical device or manufacturing industries.
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Working knowledge of Cadence Allegro Packaging Design (APD) Working knowledge of Cadence Allegro Packaging Design (APD) Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules.
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We also formed Blue Polymers, a joint venture with Ravago, to develop facilities that will further process plastic material from our Polymer Centers to help meet the growing demand for sustainable packaging.
$152,020 a yearFull-timeExpandApply NowActive JobUpdated 8 days ago - UpvoteDownvoteShare Job
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Direct experience in the development of high voltage (300 – 800 V) electromechanical systems, including creepage and clearance, dielectric isolation, cost-optimized packaging, harness design and routing, laser welding, thermal and mechanical analysis, and PCBA mechanical packaging.
$182,000 a yearFull-timeExpandApply NowActive JobUpdated 1 month ago - UpvoteDownvoteShare Job
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Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.
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Working with a multi-disciplinary team across the company through the full life cycle of product development, including RF design, packaging, product, and test engineering. The successful candidate will possess an RF design background with an excellent understanding of wireless markets and associated IC and MCM technology required to meet cutting edge product requirements.
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We have the capabilities needed to bring products to full production, including assembly, packaging and testing, and in-house sterilization. We are actively looking for a Principal Mechanical Engineer who can bring innovation and creative thinking to the team.
$170,000 a yearFull-timeExpandApply NowActive JobUpdated 18 days ago - UpvoteDownvoteShare Job
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We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.
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The Graphic Communication Division of FUJIFILM North America Corporation is the largest graphic distributor in the US. We deliver world class, state of the art solutions for Ink Jet Printing, Digital Printing, Wide Format, Offset Plates, Packaging, and a full range of traditional Offset supplies.
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You are an experienced leader with a strong understanding of IC design, multi-die design, packaging and system analysis market, customer requirements and industry landscape. Expert knowledge of multi-die, advanced packaging and system analysis market and the ecosystem.
$311,000 a yearFull-timeExpandApply NowActive JobUpdated 14 days ago - UpvoteDownvoteShare Job
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Job will require frequent interaction with fab, test and reliability engineering, packaging and system engineering groups, as well as with product engineering personnel. Job RequirementsExperience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devicesExperience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
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packaging job Title: early Company: Mcdonalds Restaurants in Sunnyvale, CA
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