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Very strong understanding of characterization techniques (SIMS, XRD, SEM, TEM, etc. Strong familiarity with semiconductor wafer fabrication processes (photolithography, thin film metal deposition, dielectrics, wet/dry etching, etc.
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PVD, CVD, ALD, wet processing, spectroscopy, ellipsometry, interferometer, XPS, SEM, TEM, AFM, XRD) with hands-on experience in failure analysis. PVD, CVD, ALD, wet processing, spectroscopy, ellipsometry, interferometer, XPS, SEM, TEM, AFM, XRD) with hands-on experience in failure analysis.
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Knowledge of general materials characterization techniques such as SEM, XRD, XPS. Candidates should be actively pursuing degree programs at one of the following institutions: University of Colorado, Colorado State University, University of Minnesota, University at Buffalo, Rochester Institute of Technology, California Polytechnic State University, San Jose State University, Massachusetts Institute of Technology, or Stanford University.
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Familiar with Failure Analysis techniques such as Optical Microscopy, X-ray/CT, XRD, SEM, EDS, FIB, FTIR, GCMS etc. Familiar with Failure Analysis techniques such as Optical Microscopy, X-ray/CT, XRD, SEM, EDS, FIB, FTIR, GCMS etc.
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Experience with operating various analyses equipment such as FIB-SEM, SEM, ion milling, TGA, BET, XRD, equipment maintenance, sample preparation. Experience with operating various analyses equipment such as FIB-SEM, SEM, ion milling, TGA, BET, XRD, equipment maintenance, sample preparation.
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Routinely hands-on executed full integration of perovskite devices at every step from substrate preparation to final device testing and key material characterization (such as XRD) Working knowledge in general thin film techniques such as sputtering, CVD, ALD, evaporation, laser scribe.
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Associate or bachelor s degree in mechanical engineering, Electrical Engineering,Energy System Engineering, Materials Science, Physics or related field; OR equivalentFamiliar with Failure Analysis techniques such as Optical Microscopy, X-ray/CT, XRD, SEM, EDS, FIB, FTIR, GCMS etc.
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Western Digital, the premiere producer of hard disk drives (HDD), is seeking an equipment engineer to maintain and perform analyses on our fleet of Rigaku and Panalytical X-Ray Diffraction (XRD), X-Ray Fluorescence (XRF), and X-Ray Reflectivity (XRR) instruments.
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Familiarity with analytical methods and characterization techniques such as SEM, XRD, SAXS, TGA, DSC, Ion Chromatography and GC-MS. Familiarity with analytical methods and characterization techniques such as SEM, XRD, SAXS, TGA, DSC, Ion Chromatography and GC-MS.
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Very strong understanding of semiconductor device physics. Provide very close collaboration with R&D LED Wafer Fab Process Engineering team. MS or PhD in Materials Science and Engineering, Electrical Engineering, or Applied Physics.
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Bruker Nano Surfaces and Metrology manufactures the world's leading Atomic Forces Microscopes, Cryo Dry Cleaning systems, Stylus profilers, X-Ray Metrology (XRR, XRD, XRF, XRI, TXRF), Mask Repair, and non-contact 3D optical microscope instrumentation.
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Knowledgeable of thin film deposition and metrology methods (ex. In-depth knowledge of thin film optical coating design, equipment, process, and characterization. Hands-on experience and consistent record in relevant areas in optical coating industry, advanced process technology development, and associated equipment is ideal.
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This position requires a Ph. D. or foreign equivalent in Physics, Chemistry, Material Science, Engineering, or a related field plus knowledge/experience with all of the following: analytical chemistry operating at least two of the following characterization techniques: secondary ion mass spectroscopy (SIMS), X-ray photoelectron spectroscopy (XPS), Auger spectroscopy, RBS, AFM, XRD, and/or FT-IR to analyze semiconductor materials.
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