Packaging Module Engineer for Advanced Semiconductor Packaging
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Intel Corporation is seeking a Packaging Module Development Engineer in Phoenix, Arizona. You will innovate semiconductor packaging technologies that drive advancements in computing. Key responsibilities include developing packaging solutions and optimizing processes in collaboration with cross-disciplinary teams.
The ideal candidate holds a relevant degree with at least 4 years of experience in metrology solutions and statistical process control. This full-time role requires on-site work.
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