Hybrid Packaging Module Engineer - Advanced Assembly Tech
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Intel Corporation is seeking a Packaging Module Development Engineer in Phoenix, Arizona. This role involves developing innovative packaging solutions for semiconductor technologies and entails strong technical leadership skills and the ability to collaborate across teams. The ideal candidate should have a PhD or Master's in relevant engineering fields and a minimum of one year of experience in equipment development. The position offers a hybrid work model and a competitive compensation package. #J-18808-Ljbffr