Principal Engineer – RIE Module Engineering

Overview In this role you will provide technical leadership and strategic direction for Reactive Ion Etch (RIE) manufacturing operations. You will own module performance across safety, quality, yield, availability, cost, and output, while shaping long‑term technology and operational roadmaps. You act as the technical authority for multiple RIE platforms, drive cross‑functional improvements, influence capital planning, and develop engineering talent. This position combines deep semiconductor expertise with business acumen to lead complex initiatives through influence and collaboration. Compensation / Benefitsbase salaryfringe benefitspotential bonusescompetitive benefits package ResponsibilitiesServe as the technical authority for RIE process and equipment performance across multiple technologies and toolsetsDevelop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and qualityArchitect control strategies using SPC, FDC, APC, and advanced analyticsEstablish equipment standards, chamber matching, and process control methodologiesLead technical reviews, risk assessments, and technology transfer activitiesOwn module KPIs including Tool Availability, COUP Yield, Defectivity, Lot Holds, Cycle Time, Cost ReductionDrive systematic reduction of chronic tool and process issues via root-cause analysisLead recovery efforts for high-impact manufacturing excursionsImplement sustainable corrective and preventive actions to prevent recurrenceDevelop business cases for capital investments, upgrades, and productivity projectsInfluence equipment selection, supplier strategy, and technology roadmapsAssess future manufacturing needs and identify capacity, capability, and reliability gapsProvide recommendations balancing risk, cost, and operational impactLead cross-functional teams with Process Eng., Equipment Eng., Manufacturing, Quality, Facilities, and Product Eng.Represent the module in site leadership reviews, customer audits, and executive presentationsPartner with global engineering organizations to deploy best practices and standardize processesMentor and coach engineers across multiple levels; develop technical competency frameworks and training roadmaps Key requirementsBachelor in Chemical EngineeringMinimum 10 years of semiconductor manufacturing experienceMinimum 7 years in RIE Process Engineering, Equipment Engineering, or Module Engineering rolesDemonstrated leadership of large-scale improvement projectsExperience supporting high-volume semiconductor manufacturing environmentsDeep understanding of plasma etch processes and RIE equipmentExpertise in statistical process control (SPC)Experience with DOE, FDC, APC, Yield analysis, Root Cause Analysis (RCA), FMEA, Process qualification methodologiesStrong data analytics capabilitiesleadershipcross-functional collaborationeffective communicationSPC (statistical process control)DOE methodologyFault Detection and Classification (FDC)