Electro Mechanical Engineer

Title: Electro-Mechanical EngineerLocation: Springfield, VAContract long-termJob Description & Skill Requirement:Key ResponsibilitiesDesign 300 mm wafer chucks including vacuum chucks, edge grip mechanisms, compliant fingers, and kinematic supports.Perform stress, deformation, and warp accommodation modeling to ensure ultra low wafer stress during handling.Develop motion mechanisms for raise/lower (Z axis) and edge grip actuation that prevent wafer damage and meet precision requirements.Ensure all designs meet ISO Class 1 cleanroom particle generation specifications and support high volume, 24/7 fab operation.Select appropriate low outgassing, non particulating materials (e.g., PEEK, Vespel, Alumina, DLC, etc.) and coatings suitable for semiconductor tools.Work with controls engineers on soft landing, jerk limited motion profiles, and closed loop sensing for wafer presence, alignment, and force control.Conduct FEA simulations for thin wafer stress, contact mechanics, modal behavior, and static/dynamic loads.Perform particle testing, vacuum leak testing, wafer stress validation, and endurance testing.Generate engineering documentation: DFMEA, test plans, tolerance stackups, and SEMI/ISO compliance documents.Collaborate with cross functional teams (systems, electronics, materials, manufacturing) for prototype builds and tool integration.Technical Skills300 mm wafer handling design (edge grip, vacuum, kinematic support)Precision chuck design & compliant mechanismsFEA (ANSYS, Abaqus, COMSOL) — stress, modal, and contact analysisModeling warped/bowed wafers, thin plate mechanicsCleanroom design principles – ISO Class 1, low particle mechanismsVacuum system design, leak tight sealing, He leak testingMaterial selection for semiconductor tools:PEEK, Vespel, PTFE, PPSAlumina, Aluminum Nitride, Ti 6Al 4VHard anodize, DLC, TiN, Parylene coatingsMotion system design:Linear motors, voice coil actuators, pneumatic micro actuatorsFlexures, guides, cross roller bearingsJerk limited (S curve) motion and soft landing controlEdge grip mechanism design with low clamping forcesTolerance analysis, GD&T, DFMEA, DOESemiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644Metrology & Testing SkillsWarp, bow, TTV measurement techniquesParticle measurement and contamination controlVacuum integrity tests (helium mass spectrometer, pressure decay)Wafer alignment and edge detection sensors (optical/capacitive)Reliability testing for 24/7 fab dutySoftware SkillsCAD: SolidWorks, Creo, NXSimulation tools: ANSYS/Abaqus/COMSOLData tools: MATLAB, PythonMotion/controls: Beckhoff TwinCAT, Siemens/Omron PLCsSoft SkillsStrong cross functional collaborationRoot cause analysis (8D, 5 Whys, Ishikawa)Clear documentation & communicationOwnership and design for reliability mindset