Integration Engineer Development EoPM

Overview Join onsemi's Technology Development group as an Integration Engineer in Hopewell Junction, NY to drive process and architecture improvements for new products. You will bridge design and manufacturing to enable ramp to volume production and yield gains, impacting automotive and industrial technologies. You’ll work cross-functionally to introduce and mature new tech, delivering robust processes and packaging integration. This role offers hands-on impact across product development, process optimization, and technology scaling within a global team. Compensation / Benefitscompetitive benefits package ResponsibilitiesSupport product development from design through full-scale manufacturing with formal process-change documentationCollaborate with Manufacturing Engineering to define manufacturable process recipes meeting yield and reliability targetsDemonstrate expertise in semiconductor technology, device physics, yields, and manufacturing processesLead novel insulator integration into wafer packagingLeverage CPI experience and chip-scale module construction knowledgeWork on Power FET and Power Module experiences; copper plating and wafer thinning are plusesDevelop and optimize packaging skills: pick-and-place, sintering, CSP, advanced packagingExplore RDL, advanced packaging integration, polyimide, dicing, and module assembly as needed Key requirementsBS in Engineering or Materials Science; MS+ preferred6–10+ years in semiconductor manufacturing integration and technology developmentFamiliar with 5S, 8D, 6-sigma, SPC, DOE, FMEAFluent in English (written and verbal)cross-functional collaborationclear communication across levels including executive leadershipindependent execution and initiativesemiconductor technology and device physicsyield improvement methodologiesinsulator integration into wafer packaging