WETS Module Engineer
Overview:
In this role you will develop and support the manufacturing of 300mm silicon wafers for automotive and consumer applications. You will partner with integration, process and equipment teams to ensure robust, high-quality products in a fast-paced 24/7 environment. You will apply data-driven methods to improve cleans processes, yield and throughput while reducing cost, contributing to scalable manufacturing and new capabilities. Compensation / Benefitscompetitive benefits package
Responsibilities:
- Own Cleans processes and health of SCREEN, TEL, LAM and other equipment in a fast-paced manufacturing setting
- Implement equipment and process improvements to raise product performance, throughput and yield while reducing cost
- Design and document experiments using engineering methods to improve yield, cost and throughput
- Resolve complex, time-sensitive technical issues to maintain production schedules
- Make data-driven decisions using SPC and related analytics in Cleans area
- Provide daily process and product lot disposition support in Cleans processing
- Analyze and resolve equipment-level shifts in tool performance
- Within 6–12 months, develop advanced sustaining responsibilities and contribute to cost reduction, yield improvement and throughput gains
Key requirements:
- Bachelor in Chemical Engineering
- Minimum 3 years of semiconductor manufacturing experience
- Minimum 2 years in Cleans Process Engineering, Equipment Engineering, or Module Engineering
- Leadership of large-scale improvement projects
- Experience supporting high-volume semiconductor manufacturing
- Deep understanding of clean processes and clean equipment
- Expertise in SPCExperience with DOE, FDC, Yield analysis, Root Cause Analysis, FMEA, Process qualification methodologies
- Strong data analytics capabilitiesteam collaborationproblem solvingdata-driven decision making
- Clean processes and clean equipment expertise
- Statistical Process Control (SPC)DOE methodology