RFIC Packaging (Mechanical) Engineer

Overview As RFIC Packaging Engineer, you lead RF/microwave packaging development from concept to production, guiding design decisions for cost-effective, high-volume packaging. You collaborate with design, QA, reliability, and suppliers to optimize materials, processes, and assembly. You will troubleshoot packaging issues, model thermal behavior, and contribute to the backend technology roadmap. This role offers the opportunity to shape packaging strategies across multiple technologies in a global manufacturing environment. Compensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities ResponsibilitiesTechnical lead for RF/microwave packaging across plastic, ceramic, laminate and metal typesCollaborate with internal teams and suppliers to select and qualify appropriate packaging technologies and assembly processesEstablish and update design rules for packaging with vendors and internal engineeringImplement robust internal and contract-manufacturer assembly processesTroubleshoot packaging defects and implement corrective actionsProvide thermal modeling and application notes for new packagesCharacterize failure modes in collaboration with Quality and analyze materials/process impactSupport supplier benchmarking and track data to influence backend technology roadmap Key requirementsMS or BS +3 years in Materials Science, EE/ME with packaging process development and RF/Microwave expertiseProven track record from concept to implementation in packaging projectsExperience with high-volume contract manufacturers and packaging processesDeep knowledge of RFIC/Microwave assembly (die attach, flip chip, wire bond, etc.)Experience in failure analysis methodologyAbility to work independently under tight deadlines and manage multiple projectsStrong written and verbal communication; ability to present data and plans at meetingsStatistical methods knowledge (DOE, SPC); JMP or Minitab experienceKnowledge of standards (JEDEC, IPC, EIA, RoHS, WEEE) and reliability testingExperience with Solidworks and ANSYS FEA; AutoCAD is a plusFinite element analysis for thermal/mechanical problemsindependent work ethicstrong communicationteamworkRF/microwave packaging designthermal analysis and modelingDOE/DOE optimization