Principal Engineer, Process Development Engineering

Overview In this role you drive innovation and optimization of semiconductor manufacturing processes across wafer fabrication, assembly, and test, shaping reliability and transfer to high-volume production. You will lead cross-functional collaboration with design, manufacturing, reliability, and foundry partners to enable NPI readiness and continuous improvement. The role combines deep technical leadership with mentoring to accelerate technology readiness and yield improvements. This is a strategic technical leadership position with impact on process capability and cost optimization. Compensation / Benefitsdiscretionary performance-based bonusmedical, vision and dental coverage401kpaid vacationholidayssick time ResponsibilitiesLead development, integration, and qualification of advanced semiconductor processesDrive yield improvement, defect reduction, and cost optimization using DOE, SPC, and data analyticsEnable NPI readiness and transition from R&D to high-volume manufacturingCollaborate with design, manufacturing, reliability, and foundry partnersLead failure analysis and continuous improvement initiativesMentor engineers and provide technical leadership across teams Key requirementsMS or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field10–15+ years of semiconductor process development experienceStrong expertise in process integration, fab or assembly processesExperience with DOE, SPC, failure analysis, and reliability methodologiesKnowledge of semiconductor equipment and process control systemscross-functional leadershipcommunication skillsmentorshipDOESPCfailure analysis