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Experience with project management, lean six sigma, and root cause analysis tools such as SPC, 8D, 5 Whys, fishbone diagrams, measurement system analysis, gauge R&R, etc. Knowledge and Experience in PCBA design and manufacturing: DFM/DFA/DFT, Failure analysis, ICT and FCT, IPC-610.
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Strong expertise in statistical analysis tools, SPC methodology, DOE, data analytics using JMP or other statistical software. Improve process monitoring through SPC methodology, root cause analysis.
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Experience in experimental design execution and statistical analysis Knowledge and use of SPC/DOE principles Data extraction and analysis skills (JMP/Crystal Ball/ILM/REL/PCS/SQL Scripting.
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Strong knowledge with use of tools like: PPAP, FMEA, APQP (Control Plans), Statistical Process Control (SPC) and Measurement System Analysis (MSA). Experience with design conception in a high-volume manufacturing environment, with mechanical design technical skills (Design of gas valves; tooling and parts development assessment; stack-up analysis; FEA and resistance of materials analysis; fluid dynamics simulation understanding; interpreting engineering drawing and GD&T with working knowledge of measurement methods; layout inspection; gage calibration and industry standards for inspection and testing preferred.
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Experience implementing Lean Manufacturing and Six Sigma methodologies including statistical analysis techniques (Design of Experiments, Statistical Process Control (SPC), etc) preferred.
$63,000 - $85,000 a yearFull-timeExpandApply NowActive JobUpdated 3 days ago - UpvoteDownvoteShare Job
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Own yield improvement actions and process change decisions based on statistical process control (SPC) data analysis. Surface Finishing - Develop new processes in the area of blasting, tumbling, polishing, wet sanding, lapping, anodizing, and PVD. Ensure that quality and yield requirements are met.
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Maintain required records and documentation, as related to materials and supplies, for internal/external audit requirements including SPC, GMP, SQF and customer specific (Panda Express, Yum). The Material and Scheduling Manager is responsible for material flow and inventory management to meet production schedules and customer requirements, designing and implementing effective production schedules through appropriate analysis of material inventories, production progress, machine capacity and customer orders.
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1+ years of experience in advanced data analysis (using JMP, GAJT and/or SQL), statistical process control (SPC), and design of experiment (DOE) principles. Collaborates with Yield Analysis, Device and Defect Engineers, SPPD (SiP Product Division) designers, and Process Engineers to ensure new processes and products are capable of meeting yield and reliability requirements at the time of PRQ, and setup systems that enable best balance of manufacturability and quality for Production Ramp.
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Develops solutions and solves problems utilizing formal education, experience, statistical analysis, and problem-solving methodologies / tools. As a Silicon Photonics (SiP) Process Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products.
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You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This job req is for an Experienced (Senior or Principle) Thin Film process development engineer in Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems.
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Additional responsibilities include using SPC (Statistical Process Control), designing and conducting wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for production line to follow; and reviewing, updating, and maintaining documentation and process instructions.
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SPC, SQL, Queries, Python, MATLAB, Mathworks, Excel Macros, Minitab, PMP, JMP, Spotfire, OpenCV, AI. Projects cover the full spectrum from designing a collaborative anthropometric robot packaging machine an FFT analysis of acoustical signatures.
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Wafer process development/manufacturing experience with Six Sigma/lean manufacturing/SPC/APC - Prefer JMP, R, and Python skills. (To qualify for the Principal Level: MS + 7 years or PhD + 3 years of experience, highly skilled in multiple technical areas including wafer processing, materials engineering with an emphasis on diamond and/or laser processing, along with advanced statistical analysis applied to high-volume manufacturing.
$70,000 - $300,000Full-timeExpandApply NowActive JobUpdated 3 days ago - UpvoteDownvoteShare Job
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Advanced degree in Materials Engineering, Physics (with a focus on materials, laser, or optics), or Mechanical Engineering, with a minimum of 5+ years of relevant experience. Preferred experience: Exposure or experience with smart cameras or machine vision, experience with microscopes, and/or lens selection for machine vision, proficiency in motion systems (G-code/CAM), Six Sigma Black/Green Belt certified, and experience with laser process optimization.
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Provide training, subject matter expertise & support to manufacturing operations, customers, suppliers, engineering, and Eaton Aerospace partners on IM&TE, MSA (Measurement Systems Analysis)/Gage R&R (Gage Repeatability & Reproducibility) and SPC (Statistical Process Control), including interpretation of results.
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