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Sr. Mechanical Engineer (Electronics Packaging)
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- Our teams have repeatedly been recognized for outstanding performance by some of the most prestigious organizations in the world including The Boeing Company, Lockheed Martin, NASA & Northrop Grumman.
- Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)
- Design experience with electronic packaging approaches for defense and aerospace applications including: Design for high shock and high vibration environments Design for challenging thermal conditions Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).
- Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.
- Experience with design for manufacturability Knowledge of machining operations, brazing, and additive manufacturing.
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