Upvote
Downvote
Sr / Engineer - Semiconductor Advanced Packaging (HBM Integration)
Share Job
- Suggest Revision
- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- The Shift Engineers will be responsible for overseeing the operation, maintenance, and optimization of semiconductor advanced packaging processes, with a specific focus on HBM integration AND/OR across CMP, WET, ETCH, PHOTO, CVD, bonding, debonding, TCD, wafer preparation, hybrid bonding, pre- and post-encapsulation, and other relevant processes.
- Process Optimization : Collaborate with process engineers to optimize semiconductor packaging processes for improved yield, reliability, and performance.
- Training and Development : Train and mentor new operators and technicians on semiconductor packaging processes, equipment operation, and safety procedures.
- Education : Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Science or related field.
Active Job
Updated 3 days agoSimilar Job
Relevance
Active