The Boeing Company

As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us.. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.. Either: 5+ years of experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- 5+ years of experience with Printed Circuit Boards (PCB) design or assembly. Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics. A signing bonus may be available to external candidates who have an active Top Secret or Top-Secret SCI U.S. Security Clearance at the time of application.

analysis engineer

Job Description
At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We're committed to fostering an environment for every teammate that's welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
Boeing Space, Intelligence & Weapons Systems is currently hiring multiple Lead and Senior Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join us as part of our Electronics Packaging and Product Design Team located in El Segundo, CA .
We are seeking exceptional Mechanical Engineers with a passion for innovation to join our team and become part of something truly remarkable. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us.
We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.
You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure.
To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment.
Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We're highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement. #TheFutureIsBuiltHere
Position Responsibilities:
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Resolves complex issues on critical programs related to architectural approaches, requirements, specifications and design.
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Leads technical aspect of proposal preparation.
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Identifies critical performance measures and develops processes for computing them.
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Leads activities in support of Supplier Management with make/buy recommendations and other technical services.
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Coordinates engineering support throughout the lifecycle of the product.
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Develops new concepts for future product designs to meet projected requirements.
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Recommends and manages technology insertion.
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Works under consultative direction.
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</ul>
This position is expected to be 100% onsite. The selected candidate will be required to work onsite in El Segundo, CA. Hybrid schedules are rare, but may be discussed post-start; and is at the discretion of your direct manager, dependent on business needs and circumstances.
This worksite participates in Boeing's optional 9/80 schedule rotation. 9/80 is a rotation in which employees can work 9-hour shifts, 8 days per pay period (bi-weekly) and receive every other Friday off.
Some positions may require up to 20% travel domestically and/or internationally depending on business requirements.
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret, or Top Secret SCI Clearance Post-Start is required (based on the position selected for).
Basic Qualifications (Required Skills/Experience):
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Ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship
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Bachelor's Degree in Mechanical or Aerospace Engineering
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10+ years of experience utilizing Computer-Aided Design (CAD) tools
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Either: 5+ years of experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- 5+ years of experience with Printed Circuit Boards (PCB) design or assembly
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<li>
5+ years of experience with electronic packaging or product design and analysis
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</ul>
Preferred Qualifications (Desired Skills/Experience):
<h3>Senior Engineers</h3>
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PhD in Mechanical or Aerospace Engineering (also accepted Electrical, Computer, or Controls Engineering)
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10+ years of experience with electronic packaging design and/or analysis
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</ul>
-OR-
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<li>15+ years of experience with electronic packaging design and/or analysis</li>
</ul>
<h3>Principal Engineers</h3>
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<li>
PhD in Mechanical or Aerospace Engineering (also accepted Electrical, Computer, or Controls Engineering)
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<li>
15+ years of experience with electronic packaging design and/or analysis
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</ul>
-OR-
<ul>
<li>20+ years of experience with electronic packaging design and/or analysis</li>
</ul>
Other Helpful Experience & Qualifications:
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<li>
An active Top Secret /SCI clearance
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Experience within aerospace or related industry or with space electronics
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Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
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Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers
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Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
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Experience leading teams on complex projects
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</ul>
Typical Education/Experience:
<h3>Lead</h3>
Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
<h3>Senior</h3>
Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+9 years' related work experience, Master+12 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
<h3>Principal</h3>
Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 20 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+15 years' related work experience, Master+18 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard
Relocation:
This position offers relocation based on candidate eligibility. Note: Basic relocation will be offered for eligible internal candidates.
Drug Free Workplace:
Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.
Shift Work:
This position is for 1st shift.
At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.
The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.
The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Please note that the salary information shown below is a general guideline only. Salaries are based upon candidate experience and qualifications, as well as market and business considerations.
Summary pay range for Lead Level: $128,350 - $173,650
Summary pay range for Senior Level: $153, 850 - $208,150
Summary pay range for Principal Level: $181,650 - $246,100
A signing bonus may be available to external candidates who have an active Top Secret or Top-Secret SCI U.S. Security Clearance at the time of application .
#EESpace
Eligible for Employee Referral Program (ERP)
Equal Opportunity Employer:
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law. 
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