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Senior / Principal Equipment Development Engineer Wafer Bonding
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Full-time
- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- We at Micron Technology are seeking a Sr./Principal Equipment Development Engineer (Wafer Bonding) to join our R&D Equipment team in Boise, ID!
- As a Senior/Principal Equipment Development Engineer in TD's wafer bonding Tech Dev (TD) team, you will be primarily responsible for developing and optimizing next-generation wafer bond equipment (bond, trim, grind, and others) to improve capability, productivity and cost of such equipment.
- You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology.
- You will grow into an expert engineer, driving wafer bonding/wafer grind/edge trim technology roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.
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