Vault Personnel Pte. Ltd

Failure analysis and root cause investigation, report preparation & presentation. Experience in high volume electronics manufacturing environment preferably semiconductor or camera module assembly.. Familiar with JMP data analysis capability. Microsoft Office knowledge in APQP, DOE, SPC, FMEA, MSA, and Six Sigma will be an advantage. Industry: Semiconductor/Wafer Fabrication

process development

Responsibilities:

Expertise in root cause analysis and problem solving

Process / machine improvement and implementation of underfill machine/ processcustomer engineering builds

DOE activities and report submission & presentation

Failure analysis and root cause investigation, report preparation & presentation

Work with third party and identify solutions to enhance capabilities

Coordinate all customers’ engineering builds and qualification builds with relevant factory teams to maximize our resources

Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers

Set & monitor the KPI for the team base on underfill development projects

Requirements:

Bachelor's Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline

Experience in high volume electronics manufacturing environment preferably semiconductor or camera module assembly. OSAT experience will be an advantage

Minimum 7 years working experience as Underfill Process or Development Engineer

Must be familiar and have hands on experience with Asymtek and Camalot underfill machines

Familiar with JMP data analysis capability

Proven experience in underfill process (at least 7 years experience)

Knowledge and experience in package singulation is an advantage

Microsoft Office knowledge in APQP, DOE, SPC, FMEA, MSA, and Six Sigma will be an advantage

Excellent communication skills

Other information:

Location:  Ang Mo Kio

Salary:  $5K to $6K

Industry:  Semiconductor/Wafer Fabrication

Recommended Skills:

Advanced Product Quality Planning

Applied Physics

Assembly And Installation

Communication

Data Analysis

Electronics Manufacturing

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