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Packaging Design Lead
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- This startup is developing groundbreaking hardware, software, and systems to solve the critical bottlenecks in next-generation computing workloads – at any scale – across hyperscale cloud, edge, enterprise, 5G/6G, and automotive infrastructure.
- Packaging Design Lead
- Collaborate on package planning and integration with die, package, and PCB design teams.
- Specify and analyze power and high-speed signaling requirements for high-speed networking systems across die, package, PCB, connectors, and cabling.
- Proficient in hands-on design of large body size, high power, high speed substrates using Cadence APD/SIP.
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