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Package Design Engineer
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- Our client is a leading maker of ICs and Modules for Mobile, 5G, and Data Center Networking applications.
- They are currently seeking a Package Design Engineer who has experience designing and engineering complex flip-chip BGA packages, along with automating the design work with Cadence SKILL programming for Allegro.
- The automation will be used by the company’s design team to improve everyone’s productivity.
- Experience with ASIC and/or high-speed SerDes Package Design is highly preferred.
- The ideal candidate will be a BS (or better) in Mechanical, Electrical, Chemical, or Computer Engineering with 2-5 years, or more in either IC Package Design OR Design Automation for IC Packaging.
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