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Architect / Technical Lead - System / Packaging / Thermal
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- SambaNova Systems is seeking an experienced and passionate System / Packaging / Thermal Engineering Lead / Architect to drive the most advanced system/packaging technology from conception to production.
- Pathfinding - establish relationship with foundry, OSAT, material supplier to develop package development roadmap; plan test vehicle when necessary
- Product development - manage design process, review thermal, mechanical analysis result, final product sign off.
- MS in Mechanical Engineering, Materials Science, or a similar field
- Extensive experience in leading thermal architecture design, modeling, development and testing for custom silicon chips and system solutions (including liquid-cooling, air-cooling ) for enterprise systems.
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