Applied Scientist, Materials and Process Development, AWS Center for Quantum Computing

Overview In this role you contribute to materials integration for superconducting quantum processors, driving R&D from process development to hardware demonstration. You join a multi-disciplinary team to advance thin-film deposition, device interfaces, and scalable integration architectures. You will translate materials advances into production through cross-functional collaboration and publish key findings. This position offers the opportunity to influence wafer-scale fabrication strategies and stay at the forefront of superconducting materials science. Compensation / Benefitssign-on payments and restricted stock units (RSUs)comprehensive health insurance (medical, dental, vision, prescription)401(k) matchingpaid time offparential leaveflexible benefits and perks ResponsibilitiesDevelop and optimize materials for superconducting quantum hardware, focusing on thin-film deposition and integration solutions that enable higher qubit densityEstablish process-structure-property relationships for production-relevant films and interfacesQualify new tools and process modules for scalable fabricationDesign integration schemes compatible with larger wafer formatsCoordinate with cross-functional teams to translate materials advances into productionPublish results in scientific journals when appropriate Key requirementsPhD in mechanical engineering, electrical engineering, material science, physics or equivalentExpertise in thin-film deposition and process integration at 200 mm wafer scale or largerExpertise in thin-film characterizationstrong scientific and engineering principlesresourcefulness and bias for actionexcellent communication skillsthin-film depositionprocess integration at wafer scale (200 mm+)thin-film characterization