Thin Film Process Engineer

Overview In this role you drive sustaining and advancing epitaxial and implant processes in a high-volume wafer fab. You’ll work to meet factory indicators, improve process performance, and enable new product introductions and transfers. Collaboration with cross-functional teams supports growth in GaAs, GaN and Si technologies, contributing to MACOM’s leadership in connectivity infrastructure. You will tackle yield, reliability, cost, and safety challenges to push process capability. This is a hands-on, impact-oriented engineering role with clear ownership and opportunities to shape foundry capabilities. Compensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities ResponsibilitiesSustain EPI/Implant operations to meet factory metricsDrive continuous improvement of processes and proceduresDevelop new processes for new products and transfersImprove quality, reliability, cost, yield, stability, productivity, and safetyCollaborate with cross-functional teams to optimize processesDocument specifications and work instructionsAnalyze data to summarize findings and support decision making Key requirementsBS or higher in Engineering with 5+ years in EPI/Implant processingExperience with compound semiconductor processes for high frequency applicationsFamiliarity with epitaxial growth, ion implantation and annealing in compound semiconductorsStrong understanding of device physics, IC processing, data mining, SPC, DOE, Lean/Six SigmaProven problem-solving, project ownership, and ability to meet deadlinesstrong ownership and driveeffective communication (verbal and written)collaboration across cross-functional teamsepitaxial growth (GaAs, GaN)ion implantation and annealing processesdata mining and statistics