Plating Process Engineer

Responsibilities Manage process based on understanding the plating process Operate plating process and equipment and analyze optimization condition Maintain processes in accordance with customer specifications and internal operational standards Develop and standardize process recipes through structured engineering practices Perform statistical process control and monitoring using appropriate statistical tools Analyze defects and implement continuous process improvement Perform engineering and process-related tasks in a semiconductor cleanroom environment while following strict contamination control procedures and safety protocols Requirements Understandingofchemicalconcentration analysis devices and methods Proficiency in Microsoft Excel and statistical analysis tools such as JMP or Minitab Strong organizational, interpersonal, and communication skills Ability to work in a semiconductor cleanroom environment and safely handle or be exposed to chemicals commonly used in semiconductor manufacturing processes Qualifications Ability to work independently with minimal supervision while meeting commitments and deadlines Ability to quickly learn and adapt to new technologies and processes Highly motivated, self-driven, and detail-oriented with a strong work ethic Education Bachelor’s degree in mechanical, Chemical Engineering, or related fields Experience 1-year experiences in Semiconductor, PWB, OSAT preferred but not required Salary $70,000 – $80,000 Benefits 401K 6% matching (NO vesting period) Healthcare 100% support (Health, Dental, Vision) Life, STD, LTD 100 % support PTO and self-development #J-18808-Ljbffr