Microelectronics Wire Bonder

MUST BE A US CITIZEN (ITAR REQUIREMENT). Support a Fortune 500 Aero-Defense Company as a Microelectronics Wire Bonder. What You’ll Do:• Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.• Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.• Read and interpret assembly process/work instructions and work instruction processes.• Work with microscopic to large components that may require visual magnification for entire shift.• Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).What We’re Looking For:• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.• Familiarity with manual bonding equipment and with automatic bonding equipment.• Ability to learn J-STD-001 and/or IPC-A-610.• Knowledge of ESD procedures and test equipment.• High school diploma or GED required.