Lead Packaging Architect for 2.5D/3D ICs
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Broadcom Inc. is seeking a talent in advanced packaging design with hands-on experience in GDSII-based physical layout. The role involves architecting advanced packaging solutions and defining design rules for new technology.
Qualifications include a Bachelor’s degree in Engineering with 5+ years of experience or a Master’s degree with 3+ years. The position offers a competitive salary range of $91,000 – $146,000 along with a comprehensive benefits package.
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