ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)

For our client, we are seeking a ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (remote) to join the team of a leader in the Telecommunications & Hardware space. This role will lead technical initiatives focused on scalable systems, platform reliability, and meaningful business transformation. You will work across engineering, product, operations, and business stakeholders to translate complex requirements into practical technology solutions. The position offers the opportunity to influence architecture, execution quality, and the technology capabilities that enable long-term growth within a Telecommunications & Hardware environment.Location: Remote - US based candidates only, no visa sponsorship availableCompensation: $183,800 – $263,600 annuallyResponsibilities Develop design rules for ultra-high-speed signaling in ASIC packaging Analyze substrate signal integrity and power integrity, collaborating with design teams Design ASIC packages for high-volume release and manage post-layout extraction Collaborate with cross-functional teams to solve complex technical issues Establish processes and tools for ASIC/package development Participate in chip architecture discussions and high-performance ASIC design Mentor junior engineers and promote a culture of continuous improvementQualifications Bachelor's degree in Electrical Engineering with 8+ years of signal and power integrity experience, or Master's with 6+ years, or PhD with 3+ years Expertise in high-speed design principles such as Transmission Line Theory and impedance network analysis Experience with signal and power integrity simulations using EDA tools like Cadence Sigrity and Ansys HFSS Proficient in conducting layout reviews and physical design validation with Cadence APD tools Familiarity with SPICE for circuit-level analysis and signal modelingBenefits Flexible work environment with remote options within the U.S Opportunity to work on cutting-edge technology in ASIC packaging Collaborative culture with cross-functional team exposure Professional development through mentorship and leadership opportunitiesOur client is an equal opportunity employer. We encourage you to apply even if you don’t meet every qualification—your background could be exactly what this team needs.