Lead Packaging Substrate Engineer — Roadmap & Innovation

A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits. #J-18808-Ljbffr