Photonics Integration Technical Lead

Photonics Engineer - Optical Test IntegrationDSJ is partnered with a leading Semiconductor Manufacturer who is looking to bring in a skilled Photonics Engineer to join their US Research & Venture Team and help shape the future of semiconductor test by integrating cutting‑edge optical, electrical, thermal, and AI/ML technologies into next‑generation test and measurement solutions. We are seeking an experienced Photonics Engineer to lead the development of co‑packaged optical (CPO) test systems within our semiconductor testing platforms.In this role, you will define and develop the optical signal path, ensuring exceptional signal integrity, reliability, and laser safety. You will collaborate closely with internal technology groups, customers, and suppliers to specify components, design system architecture, and validate integrated optical solutions. Hands‑on testing, prototype development, and optical system alignment are essential elements of this position.Key ResponsibilitiesDesign and validate optical signal paths for CPO‑based semiconductor test systems.Ensure optical signal integrity, manage losses, and analyze discontinuities.Lead system integration, including thermal considerations and mechatronic alignment.Develop test strategies, test vehicles, optical device simulators, and validation plans.Conduct optical characterization, operate test equipment, and deliver detailed reports.Collaborate with foundries on custom wafers and packaged devices when needed.Provide technical leadership, support product development teams, and mentor junior staff.Manage project execution, schedules, design inputs, and technology partner engagement.Participate in IP generation, customer discussions, and risk assessments.Required QualificationsBS in Photonics, Optical Engineering, or related field (MS preferred).8+ years (BS) or 6+ years (MS) in semiconductor test, optical integration, or similar high‑tech environments.Deep expertise in optical signal integrity, optical measurement tools, and interconnect design.Strong system‑level integration experience, including HVM scaling.Hands‑on skills in optical testing, instrumentation, and hardware modification.Desired SkillsExperience with automated test systems and semiconductor capital equipment.Familiarity with electronic packaging, instrumentation software, and Japanese language skills.