Test Module Development Engineer

Job Title: Test Module Development EngineerLocation: Phoenix, Arizona, United StateType: Full TimeHiring: Test Module Development Engineer – Advanced PackagingOur client is a global leader in semiconductor innovation, driving next‑generation technologies through its Advanced Packaging Technology Manufacturing (APTM) group. This team is at the forefront of developing breakthrough packaging solutions that go beyond traditional methods, enabling future advancements in high‑performance computing, AI, and data‑center technologies.The Test Module Development Engineer will play a key role in advancing cutting‑edge test technologies for complex semiconductor packaging solutions. This position focuses on enabling high‑mix, low‑volume manufacturing environments while supporting emerging technology development and integration.Key ResponsibilitiesLead the development and implementation of advanced test processes for next‑generation semiconductor packaging technologiesDesign and optimize test methodologies, including material selection, process parameters, and equipment integration to meet evolving product requirementsConduct feasibility studies using simulation techniques as well as hands‑on engineering approachesSupport innovation initiatives aligned with advanced packaging and foundry roadmapsDrive improvements in test equipment, tools, and workflows to enhance efficiency, yield, and production capabilityCollaborate closely with equipment vendors and material suppliers to develop enabling technologiesContribute to continuous improvement efforts through data analysis, process optimization, and industry benchmarkingCore Focus Areas3D packaging and chiplet-based architecturesHeterogeneous integration across diverse semiconductor technologiesHigh‑density packaging for AI, edge computing, and data center applicationsEnhancing thermal performance and electrical efficiencyEnabling scalable manufacturing solutions for future workloadsRequired QualificationsBachelor’s degree with 6+ years, or Master’s degree with 4+ years, or PhD in Engineering, Physics, Chemistry, or related STEM disciplineDemonstrated experience in electrical testing within semiconductor environmentsStrong knowledge of statistical process control methodologiesExperience applying engineering analysis tools such as FMEA and DOEPreferred QualificationsBackground in semiconductor packaging, test program development, or test equipment designExperience managing product lifecycle, change control processes, and engineering data systemsProven ability to lead complex, time‑sensitive technical projects and deliver measurable outcomesExposure to project management and cross‑functional collaboration in high‑tech environmentsKey Traits for SuccessStrong communication skills with the ability to convey technical concepts effectivelySelf‑driven, proactive mindset with the ability to work independentlyContinuous learning attitude and awareness of industry trendsWork EnvironmentThis role requires regular onsite engagement with engineering teams and manufacturing operations.